Designed to satisfy the highest reliability and quality expectations, the Adbc8037 packs the latest features, such as one x16 Gen3 PCI Express interface, a total of six x1 Gen2 PCI Express lanes (configurable), 3 digital plus one analog video ports, 4 SATA ports (including 2 SATA-600 interfaces), two USB 3.0 and two USB 2.0 ports and one 10/100/1000 Ethernet interface.
With support for up to 8GB soldered DDR3 ECC memory and low power configurations, the Adbc8037 is ideal to design systems that have to be very resilient to harsh operating conditions.
The pinout of the Adbc8037 can be switched from Type 6 to Type 2, allowing users to employ a single platform across a number of applications with the maximum efficiency.
The Adbc8034 supports most major operating systems, including Microsoft Windows 7, Windows, WES 7 and Wind River Linux and can be ordered with a simple to use development kit that gives access to all features of the module.
Processor
- Intel® Core™ i7-3615QE, i7-3555LE, i7-3517UE (call for other configurations)
Main Memory
- DDR3-1600 SDRAM memory down, up to 8GB, ECC capable
- Boot ROM: SPI-Flash 8MB
IO Functions
- 4x SATA (2x SATA-600, 2x SATA-300),
- 4x USB (2x USB 3.0, 2x USB 2.0),
- 1x GbE
Graphics
- 3x Digital, configurable (DisplayPort/HDMI/DVI)
- 1x Analog VGA
PCI Express
- One x16 Gen3 PEG (configurable as two x8),
- One x4 Gen2 (available as two x2),
- Two x1
Form Factor
- COM Express Type6 Basic size module
- COM Express Type2 Basic size module (DIP configuration option)
- Carrier board available for evaluation
Operating System
- Windows7, Windows Embedded Standard 7, Wind River Linux
Design Service
- Customized design of carrier board
- Design support service
RoHS
CPU:
Processor
Intel® Core™ i7-3615QE (4 cores, 2.3GHz, TDP 45W), DDR3-1600
Intel® Core™ i7-3555LE (2 cores, 2.5GHz, TDP 25W), DDR3-1333
Intel® Core™ i7-3517UE (2 cores, 1.7GHz, TDP 17W), DDR3-1333
Chipset
Mobile Intel® 7 Series Express chipset QM77
Memory:
Main Memory DDR3-1600 SDRAM memory down, up to 8GB, ECC capable
Boot ROM SPI-FLASH, 8MB
COM Express:
Standard PICMG COM.0 COM Express Module Base Spec Rev 2.0
Module Size Basic size (125 mm x 95 mm)
Pinout Type Type 6 / Type 2 (DIP Switch selectable)
PCI Express
One x16 Gen3 PEG (available as two x8)
One x4 Gen2 (available as two x2)
Two x1
Graphics
3x Digital, configurable (DisplayPort/HDMI/DVI)
1x Analog VGA
SATA 2x SATA-600, 2x SATA-300
USB 2x USB 3.0, 2x USB 2.0,
Ethernet 1x 10/100/1000Base-T
PCI 1x 32bit, 33MHz, 3.3V
LPC 1x LPC bus
SM 1x SMBus
I2C 1x I2C bus
GPIO 4x GPI, 4x GPO
Power supply:
DC 12V (VCC_12V) 12.0V, ±5%, TBD
DC 5V (VCC_5BSBY) 5.0V, ±5%, TBD
DC 3V (VCC_RTC) 3.0V, TBD
Environment:
Operation temp. 0 to +60°C
Storage temp. -10 to +70°C
Humidity Below 85%RH, no condensation
RoHS Compliant
Physical Characteristics
Dimensions: 125mm x 95mm x 16.8mm (incl. heat spreader)
Radiator: Radiators such as heat spreader and passive heat sink are available
Weight: TBD