Aurora HiVe is a line of complete and robust HPC systems, built on an innovative supercomputing architecture that allows acceleration, optimization and flexibility.
Entirely hot water cooled, finely engineered, highly dense and compact, provided with software stack and monitoring tools, the HiVe series delivers a reliable and high quality HPC solution.
One HiVe system can host a choice of ARM-64 or x86 CPUs, Intel or Nvidia accelerators as well as other PCIe components. It allows streamlining configurations, selecting only the components that fit a purpose, maximizing energy efficiency and minimizing time to solution.
The prominent modularity of the system brings a high degree of flexibility to adapt to different workloads
Applications
- Molecular dynamics and quantum chemistry
- Material science
- Rendering
- Reverse Time Migration
- Machine Learning
- Manufacturing: CAE
Highlights
- Optimized for accelerated workloads
- Extreme Energy efficiency
- Best Modularity
- Haswell and ARM-64 based nodes
- Entirely water cooled with the 2° generation Aurora Direct Hot Water Cooling
Highest density
- 1.5 PFlop/s DP or 5 PFlop/s SP per rack
- 150 kW per rack
Extreme energy efficiency
At system level with > 6 GFlops / Watt
At datacenter level with PUE of 1.05
Best flexibility
A choice of modules for different configurations: modules can provide various functionality of computation, acceleration, visualization, analytics and storage
Forward looking
New architecture based on ARM or x86 low power CPUs + Intel or Nvidia accelerators
Liquid cooling
Direct contact hot water cooled multi GPU/Phi nodes
No unnecessary components
Stripped and essential with 4 accelerators per CPU
Energy efficiency
Performance
- Up to 1.5 PFlop/s DP per rack (with Nvidia K80)
- Up to 5 PFlop/s SP per rack (with Nvidia M60)
Processor
- E3-12xx v3 – TDP up to 84W per node (on Intel modules)
- Applied Micro ARM 64-bit processor
Coprocessors and Accelerators
- NVIDIA® Tesla® K40
- NVIDIA® Tesla® K80
- NVIDIA® Tesla® M60
- NVIDIA® GForce® GTX 980
- AMD® Firepro
- Intel® Xeon Phi™ 7120x
Soldered high reliability memory
- 32 GB DDR3 (8GB per processor core)
Local storage
- 1 x 256 GB half slim 1.8” SATA SSD
- 4 x 2TB NVMe flash storage cards
Sub-modules
Each modules has space for 5 computational sub-modules fitting any ×1, ×2, ×4, ×8, or ×16 PCIe card (bootable device or an accelerator):
Standard Height Cards, 4.20” (106.7mm)
Low Profile Cards, 2.536” (64.4mm)
Half Length Cards, 6.6” (167.65mm)
Full Length Cards, 12.283” (312mm)
Architecture
- Up to 128 modules (logical nodes) per rack
Interconnect and Networks
- FDR
- each module has 2 x FDR ports (112 Gbit/s)
Module I/O front panel
- 2 x 1GigE (1 x 10 GigE on ARM version)
- 2 x USB
- 1 x VGA
- 2 x FDR Infiniband
Cooling
- Aurora Direct Liquid Cooling
Reliable, Available, Serviceable (RAS)
- Soldered memory, no fans, no hot spots
- Monitoring of system and cooling loop
- Hot swap nodes
- Eurotech ESS self-protecting software
Module Power (peak)
- 1300 W
Full system power (peak)
- 166 kW fully loaded (128 modules)
Module dimensions (H x W x D)
- 130 x 105 x 325 mm
Rack dimensions (H x W x D)
Rack weigth